Description
Applications in the Semiconductor Industry range from seals and components for process equipment used in the fabrication of integrated circuits or semiconductors.
| Segments | Environment | Elastomers | Sealing Considerations |
|---|---|---|---|
| Crystal Growth (Pulling) | 25 to 200 C .001 - .01 torr | FKM | High thermal stability, chemical resistance, good vacuum performance |
| Thermal (LPCVD) Nitride, Oxide, ... | 23 to 300 C .5 - 1.0 torr | FKM, VMQ, FFKM | High thermal stability, chemical resistance, good vacuum performance |
| Track & Lithography | 25 to 100 C ambient | FKM, EPDM FFKM (AU) | Chemical resistance - solvents |
| Dry Etch | 25 to 200 C .1 - 1.0 torr | FKM, FFKM | Chemical resistance, plasma resistance, thermal stability, non-black preferred |
| Wet Etch | 25 to 200 C ambient | FKM, TFE, FFKM | Chemical resistance, no elemental contamination |
| Resist Stripping | 25 to 250 C .001 - .01 torr | FVMQ, VMQ, FKM, FFKM | Chemical resistance - especially oxygen- rich and ozone environment |
| Cleaning | 25 to 200 C ambient | FKM, FFKM | Acid and solvent resistance, some high pH chemical resistance |
| Chemical Vapor Deposition (CVD) | 25 to 250 C .001 - .01 torr | FKM, FFKM | High vacuum performance, chemical resistance, thermal stability |
| Ion Implant | 25 to 200 C .0000001 torr | NBR, FKM | Ultrahigh vacuum performance, low outgassing and permeation |
| Physical Vapor Deposition (PVD) | 25 to 200 C .000001 - .02 torr | FKM | Ultrahigh vacuum performance, low outgassing and permeation |
| Chemical Mechanical | 25 to 80 C ambient | EPDM, FFKM | Abrasion resistance, high pH chemical resistance |
