Applications in the semiconductor industry
Applications in the Semiconductor Industry range from rubber seals and components for process equipment used in the fabrication of integrated circuits or semiconductors.
Reduce your TCO with ERIKS clean rooms
ERIKS has its own clean rooms to prevent contamination and "outgassing" of components. In these clean rooms, o-rings and other sealing products are being cleaned according to the right method. The products are made dust-free and optimally packed under stringent procedures and work instructions, for both ERIKS and non-ERIKS products, resulting in considerable time and cost savings.
Solutions for the semiconductor industry
SEMI (Semiconductor Equipment and Materials International) is a pseudo regulatory organisation offering some standards and testing procedures.
More information about sealing products for semiconductor
If you have any questions about our seals for the semiconductor industry, please contact one of our locations or fill in the contact form below.
|Crystal Growth (Pulling)||25 to 200 C .001 - .01 torr||FKM||High thermal stability, chemical resistance, good vacuum performance|
|Thermal (LPCVD) Nitride, Oxide, ...||23 to 300 C .5 - 1.0 torr||FKM, VMQ, FFKM||High thermal stability, chemical resistance, good vacuum performance|
|Track & Lithography||25 to 100 C ambient||FKM, EPDM FFKM (AU)||Chemical resistance - solvents|
|Dry Etch||25 to 200 C .1 - 1.0 torr||FKM, FFKM||Chemical resistance, plasma resistance, thermal stability, non-black preferred|
|Wet Etch||25 to 200 C ambient||FKM, TFE, FFKM||Chemical resistance, no elemental contamination|
|Resist Stripping||25 to 250 C .001 - .01 torr||FVMQ, VMQ, FKM, FFKM||Chemical resistance - especially oxygen- rich and ozone environment|
|Cleaning||25 to 200 C ambient||FKM, FFKM||Acid and solvent resistance, some high pH chemical resistance|
|Chemical Vapor Deposition (CVD)||25 to 250 C .001 - .01 torr||FKM, FFKM||High vacuum performance, chemical resistance, thermal stability|
|Ion Implant||25 to 200 C .0000001 torr||NBR, FKM||Ultrahigh vacuum performance, low outgassing and permeation|
|Physical Vapor Deposition (PVD)||25 to 200 C .000001 - .02 torr||FKM||Ultrahigh vacuum performance, low outgassing and permeation|
|Chemical Mechanical||25 to 80 C ambient||EPDM, FFKM||Abrasion resistance, high pH chemical resistance|